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v|tome| x s

v|tome|x s

The phoenix v|tome|x s is a versatile high-resolution system for 2D X-ray inspection and 3D computed tomography (micro ct and nano ct)) as well as for 3D metrology. To allow high flexibility, the phoenix v|tome|x s may optionally be equipped with both, a 180 kV / 15 W high-power nanofocus X-ray tube and a 240 kV / 320 W microfocus tube. Due to this unique combination, the system is an very effective and reliable tool for a wide range of applications from extreme high-resolution scans of low absorbing materials as well as for 3D analysis of high absorbing objects.

Key Features:

Customer Benefit:

Applications

3D Computed Tomography

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The classic application of industrial X-ray 3D computed tomography (micro ct and nano ct) is the inspection and three-dimensional measurement of metal and plastic castings. However, phoenix|x-ray’s high-resolution X-ray technology opens up a variety of new applications in fields such as sensor technology, electronics, materials science, and many other natural sciences.

Microfocus CT (micro ct) showing a lambda probe: the weld seams of the case, crimp connections, the geometric alignment of the probe, and the condition of the ceramic sensor.

Material Science

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High-resolution computed tomography (micro ct and nano ct) is used for inspecting materials, composites, sintered materials and ceramics but also to analyze geological or biological samples. Materials distribution, voids and cracks are visualized three-dimensionally at microscopic resolution.

nanoCT® of an object made of glass fiber-reinforced plastic: Orientation and distribution of the glass fibers as well as agglomerations of mineral filler (purple) are visible. Fiber width is app. 10 µm.

Geology & Exploration

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High-resolution computed tomography (micro ct and nano ct) is widely used in inspecting geological samples, for example in the exploration for new resources. High-resolution CT-systems  provide three-dimensional images at microscopic resolution of rock samples, binders, cements and cavities and help identify certain sample characteristics such as size and location of voids in oil-bearing rock.

nanoCT® of a sample of biogenic methane-lime. The rock was faded out to better visualize the void structure. The voxel resolution of 2 µm enables the analysis of even the finest interior structures. (Images courtesy of the Geoscience Center, Goettingen University)

Metrology

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3D metrology with X-ray is the only technique allowing to non-destructively measure the interior of complex objects. By contrast with conventional tactile coordinate measurement technique, a computed tomography scan of an object acquires all surface points simultaneously – including all hidden features like undercuts which are not accessible non-destructively using other methods of measurement. The v|tome|x s has a special 3D metrology package that contains everything needed for dimensional measuring with the greatest possible precision, reproducibility and user-friendliness, from calibration instruments to surface extraction modules. In addition to 2D wall thickness measurements, the CT volume data can be quickly and easily compared with CAD data, for example, in order to analyse the complete component to ensure it complies with all specified dimensions.

CAD variance analysis and measurement of three features of a cylinder head.

Plastics Engineering

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In plastics engineering, high-resolution X-ray technology is used to optimize the casting and spraying process by detecting contraction cavities, blisters, weld lines and cracks, and to analyze flaws. X-ray computed tomography (micro ct and nano ct) provides three-dimensional images of object characteristics such as grain-flow patterns and filler distribution as well as of low-contrast defects.

Microfocus computed tomography (micro ct) image of a spray-cast gear wheel after automated void analysis. Along the teeth, where the material is most concentrated, contraction cavities have formed. The color indicates the size of the contraction cavities.

Sensorics and Electrical Engineering

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In the inspection of sensors and electronic components, high-resolution X-ray technologies are mostly used to inspect and evaluate contacts, joints, cases, insulators and the situation of assembly. It is even possible to inspect semiconductor components and electronic devices (solder joints) without having to disassemble the device.

Microfocus computed tomography (micro ct) of a crimp connection with a crimp height of 1.4 mm. To determine the number of individual strands and the crimping density, three tomographic layers, of the inlet area, the outlet area and the crimping zone itself (green), are generated: 19 strands enter, but only 17 exit the crimping zone. Due to the lack of material, small voids developed inside the crimping zone..

Specifications

Max. tube voltage 240 kV
Max. output 320 W
Detail detectability Up to 1 µm
Min. focus-object-distance 4.5 mm
Max. voxel resolution (depending on object size) < 2 µm (3D), nanoCT® configuration for voxel resolution <1μm (3D)
Geometric magnification (2D) 1.46 times up to 180 times
Geometric magnification (3D) 1.46 times up to 100 times
Max. object size (height x diameter) 420mm x 135mm / 16.5" x 5.3"
Max. object weight 10 kg/ 22 lb
Manipulation Stable and flexible 5-axis manipulator with precision rotary table
2D X-ray imaging yes
3D computed tomography yes
Advanced surface extraction yes (optional)
CAD comparison + dimensional measurement yes (optional)
System size 2330 mm x 1690 mm x 1480 mm / 91.7” x 66.5” x 58”
System weight 2900kg / 6393.4 lb
Radiation Safety - Full protective radiation safety cabinet according to the German RöV (attachment 2 nr. 3) and the US Performance Standard 21 CFR 1020.40 (Cabinet X-ray Systems)
- Radiation leakage rate: < 1.0 µSv/h measured 10 cm from cabinet wall