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v|tome|x m

v|tome|x m

The phoenix v|tome|x m is a versatile X-ray microfocus CT system for 3D metrology and analysis with up to 300 kV / 500 W.

Within the phoenix v|tome|x m, GE’s unique 300 kV microfocus X-ray tube is for the first time available in a compact CT system for industrial process control as well as for scientific research applications. Beyond down to < 1 µm detail detectability, the system offers industry leading magnification at 300 kV. GE’s high dynamic DXR digital detector array and the click & measure|CT automatization functionality make it an efficient 3D tool for industrial inspection and scientific research. Due to its dual|tube configuration, detailed 3D information for an extremely wide sample range is provided: from high resolution nanoCT® of low absorbing samples up to high power µCT applications such as turbine blade inspection.

NEW: The phoenix v|tome|x m is now also available in specific countries as special metrology edition with a measurement accuracy of 4+L/100 µm referring to VDI 2630 guideline (measured as deviation of sphere distance in tomographic static mode SD (TS), method details referring to VDI 2630-1.3 guideline on request, valid only for phoenix v|tome|x m metrology edition).

Key features:

 

Customer benefits:

 

Applications

3D Computed Tomography

The classic application of industrial X-ray 3D computed tomography (micro ct and nano ct) is the inspection and three-dimensional measurement of metal and plastic castings. However, phoenix|x-ray’s high-resolution X-ray technology opens up a variety of new applications in fields such as sensor technology, electronics, materials science, and many other natural sciences. E.g. turbine blades, Turbine blades are complex high-performance castings which have to fulfill highest quality and security-requirements. CT allows failure analysis as well as precise and reproducible 3D measurements (eg. wall-thickness). The CT system phoenix v|tome|x m 300 with the first unipolar 300 kV microfocus X-ray tube is ideally suited for this application field.

Material Science

High-resolution computed tomography (micro ct and nano ct) is used for inspecting materials, composites, sintered materials and ceramics but also to analyze geological or biological samples. Materials distribution, voids and cracks are visualized three-dimensionally at microscopic resolution. E.g. nanoCT® of a glass fiber-composite material: The fiber direction of the fiber mats (blue) and the matrix resin (orange) are displayed. Right: Voids inside the resin appear as dark cavities. Left: The resin has been faded out to better visualize the fiber mats. The individual fibers inside the mat are visible.

Sensorics and Electrical Engineering

In the inspection of sensors and electronic components, high-resolution X-ray technologies are mostly used to inspect and evaluate contacts, joints, cases, insulators and the situation of assembly. It is even possible to inspect semiconductor components and electronic devices (solder joints) without having to disassemble the device. E.g. Microfocus computed tomographic (micro ct) image of a lamda probe (connector-side view) showing the Inconell-protective case (yellow), including laser welded seams, crimp connections (blue) and contacts of the ceramic oxygen sensor (blue/red).

Metrology

Reproducible 3D metrology with X-ray is the only technique allowing to non-destructively measure the interior of complex objects. By contrast with conventional tactile coordinate measurement technique, a computed tomography scan of an object acquires all surface points simultaneously – including all hidden features like undercuts which are not accessible non-destructively using other methods of measurement. The v|tome|x L 300 has a special 3D metrology package that contains everything needed for dimensional measuring with the greatest possible precision, reproducibility and user-friendliness, from calibration instruments to surface extraction modules. In addition to 2D wall thickness measurements, the CT volume data can be quickly and easily compared with CAD data, for example, in order to analyze the complete component to ensure it complies with all specified dimensions. E.g. 3D measurement of a cylinder head

Casting & Welding

Radiographic non-destructive testing is used to detect flaws in castings and welds. The combination of microfocus X-ray technology and industrial X-ray computed tomography (micro CT) enables defect detectability in the micrometer range and provides three-dimensional images of low-contrast defects. E.g. 2D / 3D analysis and metrology of a control arm.

Specifications

X-ray tube type Open directional high-power microfocus X-ray tube, closed cooling water circuit. Optional additional (open) transmission high power nanofocus X-ray tube
Max. voltage / power 300 kV / 500 W. Alternatively available with 240 kV / 320 W microfocus X-ray tube Optional additional 180 kV / 15 W in dual|tube configuration. Easy tube exchange just by a push of a button
Geometrical magnification (3D) 1.3 x to 100 x at 800 mm FDD, optional 1.5 x to 75 x at 600 mm (min. sample Ø 2 mm); up to 200 x with nanofocus tube
Detail detectability Down to < 1 micron (microfocus tube); optional down to < 0.5 micron (nanofocus tube)
Min. voxel size Down to 1 micron (microfocus tube); optional down to < 1 micron (nanofocus tube)
Measurement accuracy 4+L/100 µm referring to VDI 2630-1.3 guideline*
Detector type (all according US ASTM E2597- 07 standard) Temperature stabilized digital GE DXR detector array, 200 µm pixel size, 1,000 x 1,000 pixels, 200 x 200 mm, dynamic range > 10,000 : 1, up to 30 frames per second, 2 x detector enlargement (virtually max. 2,000 pixel).Optional 400 x 400 mm large DXR detector bundle(without detector enlargement)
Manipulation Granite based precision 5-axes manipulator (6-axes with detector shift)
Focus-detector-distance 800 mm fixed; alternatively 600 mm fixed
Max. sample diameter x height 360 mm x 600 mm; up to 500 x 600 mm with limited travel range, max. 3D scanning size up to 290 mm x 400 mm
Max. sample weight High accuracy CT up to 20 kg (44 lbs.); max. up to 50 kg (110 lbs.)
Focus object distance (microfocus tube) 8 mm to 600 mm at FDD 800; alternatively 8 mm to 400 mm at FDD 600 (min. sample Ø 2 mm)
System dimensions W x H x D 2,620 mm x 2,060 mm x 2,980 mm (103” x 81” x 117.3) D 1,570 mm (62”) without user panel and generators
System weight (without ext. components) Appr. 7,800 kg /17,200 lbs. (300 kV configuration) Appr. 6,250 kg /13,700 lbs. (240 kV configuration)
Temperature stabilization Active X-ray tube cooling | temperature controlled cabinet | temperature stabilized detector
Opt. 2D inspection bundle Tilt and rotation axes for tilted 2D inspection of samples up to 10 kg (22 lbs.) | 2D inspection software
Opt. 3D metrology bundle High accuracy direct measuring system | 2 calibration objects | phoenix datos|x CT software package “metrology”
Opt. nanoCT® bundle 80 kV / 15 W high power nanofocus tube | Precision rotation unit with air bearings | diamond|window
click&measure|CT package included
Software phoenix datos|x 3D computed tomography acquisition and reconstruction software. Different 3D evaluation software packages for 3D metrology, failure or structure analysis on request
Radiation protection The radiation safety cabinet is a full protective installation without type approval according to the German RöV, French NFC 74 100 and the US Performance Standard 21 CFR 1020.40. For operation, other official licenses may be necessary