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v|tome|x L 450

v|tome|x L 450

The phoenix v|tome|x L 450 is a versatile high-resolution microfocus system for 2D and 3D computed tomography (micro ct) and 2D non-destructive X-ray inspection. With its granite-based manipulation it is handling even large samples with highest precision. The system is an optimal solution for void and flaw detection and 3D metrology (e.g. first article inspection) of castings. An optionally second X-ray tube allows to adapt the v|tome|x L 450 to any kind of industrial and scientific CT application.

Key Features:


Customer Benefits:


Applications

3D Computed Tomography

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The classic application of industrial X-ray 3D computed tomography (micro ct and nano ct) is the inspection and three-dimensional measurement of metal and plastic castings. However, phoenix|x-rays high-resolution X-ray technology opens up a variety of new applications in fields such as sensor technology, electronics, materials science, and many other natural sciences.

Turbine blades are complex high-performance castings which have to fulfill highest quality and security-requirements. CT allows failure analysis as well as precise 3D measurements (e.g. wall-thickness).

Material Science

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High-resolution computed tomography (micro ct and nano ct) is used for inspecting materials, composites, sintered materials and ceramics but also to analyze geological or biological samples. Materials distribution, voids and cracks are visualized three-dimensionally at microscopic resolution.

nanoCT® of a glass fiber-composite material: The fiber direction of the fiber mats (blue) and the matrix resin (orange) are displayed. Right: Voids inside the resin appear as dark cavities. Left: The resin has been faded out to better visualize the fiber mats. The individual fibers inside the mat are visible.

Sensorics and Electrical Engineering

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In the inspection of sensors and electronic components, high-resolution X-ray technologies are mostly used to inspect and evaluate contacts, joints, cases, insulators and the situation of assembly. It is even possible to inspect semiconductor components and electronic devices (solder joints) without having to disassemble the device.

Microfocus computed tomography (micro ct) of a crimp connection with a crimp height of 1.4 mm. To determine the number of individual strands and the crimping density, three tomographic layers, of the inlet area, the outlet area and the crimping zone itself (green), are generated: 19 strands enter, but only 17 exit the crimping zone. Due to the lack of material, small voids developed inside the crimping zone

Metrology

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3D metrology with X-ray is the only technique allowing to non-destructively measure the interior of complex objects. By contrast with conventional tactile coordinate measurement technique, a computed tomography scan of an object acquires all surface points simultaneously – including all hidden features like undercuts which are not accessible non-destructively using other methods of measurement. The v|tome|x s has a special 3D metrology package that contains everything needed for dimensional measuring with the greatest possible precision, reproducibility and user-friendliness, from calibration instruments to surface extraction modules. In addition to 2D wall thickness measurements, the CT volume data can be quickly and easily compared with CAD data, for example, in order to analyse the complete component to ensure it complies with all specified dimensions.

3D measurement of a cylinder head

Casting & Welding

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Radiographic non-destructive testing is used to detect flaws in castings and welds. The combination of microfocus X-ray technology and industrial X-ray computed tomography (mico ct) enables defect detectability in the micrometer range and provides three-dimensional images of low-contrast defects.

Three-dimensional microfocus CT (micro ct) of an aluminum casting containing some voids