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Nanotom M

phoenix nanotom m

The new phoenix nanotom® m is a nanoCT® system for scientific and industrial computed tomography (micro ct and nano ct) and 3D metrology on a wide sample range. With its special designed 180 kV / 15 W high power nanofocus X-ray tube with internal cooling and temperature stabilized digital detector, the system realizes a unique spatial and contrast resolution on a wide sample and application range - from small biological and geological samples to medium sized industrial components like injection nozzels or injection molded plastic parts – also with metal inlays. Fully automated execution of CT scan, reconstruction and analysis process ensures its ease of use as well as fast and reliable CT results. Once scanned, the fully three dimensional CT information allows many possibilities for analysis, e.g. non-destructive visualization of slices, arbitrary sectional views, or automatic pore analysis. Since the whole geometry of the object is scanned, precise and reproducible 3D measurements of complex objects and even the automatic generation of first article inspection reports within an hour are possible.

Key Features

 

Customer Benefits

 

Applications

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3D Computed Tomography

The classic application of industrial X-ray 3D computed tomography (micro ct and nano ct) is the inspection and three-dimensional measurement of metal and plastic castings. However, phoenix|x-ray's high-resolution X-ray technology opens up a variety of new applications in fields such as sensor technology, electronics, materials science, and many other natural sciences.

nanoCT® of a SMD-inductor, size 0805 (2.0 mm x 1.2 mm). The 3D X-ray image shows the interior coil behind the end cap. In any conventional radiograph, the layers would be overlapping, but the nanoCT® succeeds in displaying the object layer by layer.

Material Science

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High-resolution computed tomography (micro ct and nano ct) is used for inspecting materials, composites, sintered materials and ceramics but also to analyze geological or biological samples. Materials distribution, voids and cracks are visualized three-dimensionally at microscopic resolution.

nanoCT® of a glass fiber-composite material: The fiber direction of the fiber mats (blue) and the matrix resin (orange) are displayed. Right: Voids inside the resin appear as dark cavities. Left: The resin has been faded out to better visualize the fiber mats. The individual fibers inside the mat are visible.

Sensorics and Electrical Engineering

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In the inspection of sensors and electronic components, high-resolution X-ray technologies are mostly used to inspect and evaluate contacts, joints, cases, insulators and the situation of assembly. It is even possible to inspect semiconductor components and electronic devices (solder joints) without having to disassemble the device

nanoCT® showing solder joints of a CSP-component. The three-dimensional shape of the solder joints, app. 400 um in diameter, and void distribution are clearly visible. Inside the solder joints, different eutectic solder phases are visible.

Metrology

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3D metrology with X-ray is the only technique allowing to non-destructively measure the interior of complex objects. By contrast with conventional tactile coordinate measurement technique, a computed tomography scan of an object acquires all surface points simultaneously – including all hidden features like undercuts which are not accessible non-destructively using other methods of measurement. The v|tome|x s has a special 3D metrology package that contains everything needed for dimensional measuring with the greatest possible precision, reproducibility and user-friendliness, from calibration instruments to surface extraction modules. In addition to 2D wall thickness measurements, the CT volume data can be quickly and easily compared with CAD data, for example, in order to analyse the complete component to ensure it complies with all specified dimensions.

CAD variance analysis and measurement of three features of a cylinder head

Plastics Engineering

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In plastics engineering, high-resolution X-ray technology is used to optimize the casting and spraying process by detecting contraction cavities, blisters, weld lines and cracks, and to analyze flaws. X-ray computed tomography (micro ct and nano ct) provides three-dimensional images of object characteristics such as grain-flow patterns and filler distribution as well as of low-contrast defects.

nanoCT® of a sample of glass fiber-reinforced plastic: Alignment and distribution of the glass fibers and agglomerations of mineral filler (purple) are clearly visible. The fibers are app.10 µm wide.

Geology / Biological Sciences

app-nanotom-geology

High-resolution computed tomography (micro ct and nano ct) is widely used in inspecting geological samples, for example in the exploration for new resources. High-resolution CT-systems provide three-dimensional images at microscopic resolution of rock samples, binders, cements and cavities and help identify certain sample characteristics such as size and location of voids in oil-bearing rock.

Specifications

Specifications  
Max. tube voltage 180 kV
Max. output 15 W
Detail detectability Up to 200nm (0.2µm)
Focus-detector-distance 150mm to 600mm
Min. voxel size < 300nm (0.3µm)
Geometric magnification (3D) 1.5 times up to 300 times
Max. object size (height x diameter) 250mm x 240mm / 9.84" x 9.45"
Max. object weight 3 kg/ 6.6 lbs.
Image chain 7-Megapixel flat panel digital detector array
2D X-ray imaging no
3D computed tomography yes
Advanced surface extraction yes (optional)
CAD comparison + dimensional measurement yes (optional)
System size (1980 x 1600 x 900 mm), (78" x 63" x 35.4")
System weight 1900kg / 4189 lb
Radiation Safety - Full protective radiation safety cabinet according to the German RôV (attachment 2 nr. 3) and the US Performance Standard 21 CFR 1020.40 (Cabinet X-ray Systems)
- Exposure rate < 1 µSv/h emission limit measured at 10 cm distance from accessible surfaces