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Important factors in the product development process
are the component optimization, usage of new materials
and the improvement of FE calculation models.
In all these areas a better understanding of the
material and component behaviour is a challenge
to experimental measuring methods.
The
interferometrical method ESPI is well suited to
measure smallest 3d-displacement and plane strain
with a resolution of approx. 10 nano meters or
1 micrometer per meter.
The
tested object is illuminated by the ESPI sensor
heading with laser light and is recorded by a
CCD camera. The interference pattern caused by
the laser and observed by the CCD camera includes
the information of the deformation in each visible
point of the measured object with a resolution
of 10 nm or 1 µm/m. |
